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| DATA SHEET www..com BIPOLAR ANALOG INTEGRATED CIRCUIT PC339 LOW POWER QUAD COMPARATOR DESCRIPTION The PC339 is a quad comparator which is designed to operate from a single power supply over a wide range of voltage. Operation from split power supplies, is also possible and the power supply current drain is very low. Further advantage, the input common-mode voltage includes ground, even though operated from a single power supply voltage. FEATURES * Common-mode input voltage range includes V- * Wide supply voltage range 2 V to 32 V (Single) 1 V to 16 V (Split) * Low supply current * Open collector output EQUIVALENT CIRCUIT (1/4 Circuit) V+ 100 A + Q1 - Q7 Q5 Q6 V- Q2 Q3 100 A PIN CONFIGURATION (Top View) PC339C, 339G2 OUT2 1 14 OUT3 13 OUT4 1 -+ 4 -+ IN Q4 Q8 OUT OUT1 2 V + 3 12 V- 11 IN4 10 II4 II II1 4 IN1 5 II2 6 IN2 7 2 -+ 3 -+ 9 IN3 8 II3 ORDERING INFORAMTION Part Number Package 14-pin plastic DIP (300 mil) 14-pin plastic SOP (225 mil) PC339C PC339G2 The information in this document is subject to change without notice. Document No. G11764EJ3V0DS00 (3rd edition) (Previous No. IC-1986) Date Published February 1997 N Printed in Japan The mark shows major revised points. (c) 1997 www..com PC339 ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Parameter Voltage between V+ and V- Differential Input Voltage Input Voltage Output Voltage Power Dissipation C Package Note 2 Note 3 Note 4 Note 1 Symbol V+ -V- VID VI VO PT Ratings -0.3 to +36 36 V- -0.3 to V- +36 V- -0.3 to V- +36 570 550 Indefinite TA Tstg -20 to +80 -55 to + 125 Unit V V V V mW mW sec C C G2 Package Note 5 Output Short Circuit Duration Operating Ambient Temperature Storage Temperature Note 6 Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction independent of the magnitude of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation will establish when any input is within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction independent of the magnitude of V+. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. 4. Thermal derating factor is -7.6 mW/C when operating ambient temperature is higher than 55 C. 5. Thermal derating factor is -5.5 mW/C when operating ambient temperature is higher than 25 C. 6. Short circuits from the output to V+ can cause destruction. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage (Split) Supply Voltage (V = GND) - Symbol V V MIN. 1 +2 TYP. MAX. 16 +32 Unit V V + 2 www..com PC339 ELECTRICAL CHARACTERISTICS (TA = 25 C, V+ = 5 V, V- = GND) Parameter Input Offset Voltage Input Offset Current Input Bias Current Voltage Gain Supply Current Common Mode lnput Voltage Range Output Saturation Voltage Output Sink Current Output Leakage Current Response Time Symbol VIO IIO IB AV ICC VICM VOL IO SINK IO LEAK VIN (-) = 1 V, VIN (+) = 0 V, IO SINK = 4 mA VIN (-) = 1 V, VIN (+) = 0 V, VO 1.5 V VIN (+) = 1 V, VIN (-) = 0 V, VO = 5 V RL = 5.1 k, VRL = 5 V 6 Conditions VO = 1.4 V, VREF = 1.4 V, RS = 0 VO * * 1.4 V = VO * * 1.4 V = RL = 15 k RL = , IO = 0 A, All Comparators 0 0.2 16 0.1 1.3 MIN. TYP. 2 5 25 200 0.8 + MAX. 5 50 250 Unit mV nA nA V/mV 2 V -1.5 0.4 mA V V mA nA s 3 www..com APPLICATION CIRCUIT EXAMPLE V+ PC339 VIN 4, 6, 8, 10 - RL 3 OUT 1, 2 13, 14 5, 7, 9, 11 VREF + 12 VREF: V- to V+ -1.5 (V) COMPARATOR with HYSTERESIS CIRCUIT V+ VRL VIN - RL OUT + R2 VREF R1 * Threshold voltage * VTH (High) = VREF + * * VTH (Low) = VREF - * R1 (VRL - VREF) RL + R2 + R1 R1 (VREF - VOL) R1 + R2 (VRL > VREF > VOL) 4 www..com PC339 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 C, TYP.) POWER DISSIPATION 1,000 1.2 RL = SUPPLY CURRENT PT - Total Power Dissipation - mW 800 ICC - Supply Current - mA TA = 0 C 1.0 600 339C 339G2 400 TA = 25 C 0.8 200 0.6 TA = 70 C 0 20 40 60 80 100 0 10 20 30 40 TA - Operating Ambient Temperature - C INPUT OFFSET VOLTAGE 3 V+ = +5 V V- = GND 50 V+ - Supply Voltage - V (V- = GND) INPUT BIAS CURRENT VIO - Input Offset Voltage - mV 2 IB - Input Bias Current - nA 40 TA = 0 C 1 0 30 TA = 25 C -1 20 TA = 70 C -2 -3 -40 -20 0 20 40 60 80 10 0 V+ 10 20 (V- 30 = GND) 40 TA - Operating Ambient Temperature - C OUTPUT SATURATION VOLTAGE 10 - Supply Voltage - V VOL - Output Saturation Voltage - V 1 0.1 TA = 70 C 0.01 TA = 25 C TA = 0 C 0.001 0.01 0.1 1 10 100 IO SINK - Output Sink Current - mA 5 www..com RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES I VO - Output Voltage - V 5.0 mV Input Overdrive 5 4 3 2 1 0 0 -50 -100 0 0.5 1.0 t - Time - s 1.5 2.0 TA = 25 C 100 mV 20 mV VIN - + PC339 RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES II VO - Output Voltage - V 100 mV Input Overdrive 5 4 3 2 1 0 VIN 100 TA = 25 C 50 0 0 0.5 1.0 t - Time - s 1.5 2.0 - + +5 V 5.1 k VO 5 mV 20 mV 5.1 k VO +5 V VIN - Input Voltage - mV 6 VIN - Input Voltage - mV www..com PC339 PACKAGE DRAWINGS 14PIN PLASTIC DIP (300 mil) 14 8 1 A I 7 K L J H G F D N M C B M R NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. ITEM A B C D F G H I J K L M N R MILLIMETERS 20.32 MAX. 2.54 MAX. 2.54 (T.P.) 0.500.10 1.2 MIN. 3.60.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 7.62 (T.P.) 6.4 0.25 +0.10 -0.05 0.25 0~15 INCHES 0.800 MAX. 0.100 MAX. 0.100 (T.P.) 0.020 +0.004 -0.005 0.047 MIN. 0.1420.012 0.020 MIN. 0.170 MAX. 0.200 MAX. 0.300 (T.P.) 0.252 0.010 +0.004 -0.003 0.01 0~15 P14C-100-300B1-1 7 www..com PC339 14 PIN PLASTIC SOP (225 mil) 14 8 detail of lead end 1 A 7 H I P F G J K E C D M M N B L NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM A B C D E F G H I J K L M N P MILLIMETERS 10.46 MAX. 1.42 MAX. 1.27 (T.P.) 0.40 +0.10 -0.05 0.10.1 1.8 MAX. 1.49 6.50.3 4.4 1.1 0.15 +0.10 -0.05 0.60.2 0.12 0.10 3 +7 -3 INCHES 0.412 MAX. 0.056 MAX. 0.050 (T.P.) 0.016 +0.004 -0.003 0.0040.004 0.071 MAX. 0.059 0.2560.012 0.173 0.043 0.006 +0.004 -0.002 0.024 +0.008 -0.009 0.005 0.004 3 +7 -3 S14GM-50-225B, C-4 8 www..com PC339 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Surface mount device PC339G2: 14-pin plastic SOP (225 mil) Process Infrared ray reflow Conditions Peak temperature: 230 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 1 time. Peak temperature: 215 C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 1 time. Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Pin temperature: 300 C or below, Heat time: 3 seconds or less (Per each side of the device). Symbol IR30-00-1 Vapor Phase Soldering VP15-00-1 Wave Soldering WS60-00-1 Partial heating method - Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Through-hold device PC339C: 14-pin plastic DIP (300 mil) Process Wave soldering (only to leads) Partial heating method Conditions Solder temperature: 260 C or below, Flow time: 10 seconds or less. Pin temperature: 300 C or below, Heat time: 3 seconds or less (per each lead.) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 9 www..com PC339 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL IC PACKAGE MANUAL GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES SEMICONDUCTORS SELECTION GUIDE NEC SEMICONDUCTOR DEVICE RELIABILITY/ QUALITY CONTROL SYSTEM - STANDARD LINEAR IC C11531E C10535E C10943X MEI-1202 X10679E IEI-1212 10 www..com PC339 [MEMO] 11 www..com PC339 [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 2 |
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